PCBasic PCB Capabilities 

Items

Manufacturing Capabilities

Remarks

Number of Layers

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1-14 layers

For orders above 14 layers, please view the below "Advanced PCB" or contact our sales rep.

Material

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FR-4, Aluminum, Copper Base

For Flex, Rigid-flex, HDI, Halogen-free, High Tg, etc., please view the below "Advanced PCB" or contact sales rep.

Maximum PCB Size(Dimension)

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Single-sided PCB and double-sided PCB: 600*1200mm Multilayer PCB: 560*1150mm

(min 3*3mm)

Any sizes beyond this dimension, please view the below "Advanced PCB" or contact sales rep.

Board Size Tolerance(Outline)

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±0.2mm/±0.5mm

±0.2mm for CNC routing, and ±0.5mm for V-scoring.

Board Thickness

0.2-3.2mm

0.2, 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4, 2.6, 2.8, 3.0, 3.2mm. Please view the below "Advanced PCB" or contact us if your board exceeds these.

Board Thickness Tolerance(t≥1.0mm)

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±10%

Normally "+ Tolerance" will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.

Board Thickness Tolerance(t<1.0mm)

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±0.1mm

Min Trace

0.1mm/4mil

Min manufacturable trace is 4mil(0.1mm), Please view the below "Advanced PCB" or contact us if your board exceeds these.

Min Spacing

Min manufacturable spacing is 4mil(0.1mm), Please view the below "Advanced PCB" or contact us if your board exceeds these.

Outer Layer Copper Thickness

1oz/2oz/3oz/4oz/5oz/6oz/7oz/8oz (35um/70um/105um/140um/175um/210um/245um/280um)

Also known as copper weight. 35μm=1oz, 70μm=2oz, 105μm=3oz, 140um=4oz, 175um=5oz, 210um=6oz, 245um=7oz, 280um=8oz, Please view the below "Advanced PCB" or contact us if you need copper weight greater than 8oz.

Inner Layer Copper Thickness

1oz/1.5oz/2oz/3oz/4oz (35μm/50μm/70um/105um/140um)

Inner copper weight as per customer's request for 4 to 10 layers. Please contact us if you need copper weight greater than 4oz.

Drill Sizes (CNC)

0.15-6.0mm

Min drill size is 0.15mm, max drill is 6.0mm. Any holes greater than 6mm or smaller than 0.2mm will be subject to extra charges.

Min Width of Annular Ring

0.15mm(6mil)

For pads with vias in the middle, Min width for Annular Ring is 0.15mm(6mil).

Finished Hole Diameter (CNC)

0.15-6.0mm

The finished hole diameter will be smaller than size of drill bits because of copper plating in the hole barrels

Finished Hole Size Tolerance(CNC)

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PTH: +/-0.08mm, NPTH: +/-0.05mm

For example, if plated through hole size is 0.6mm, the finished hole diameter ranges from 0.52mm to 0.68mm will be considered acceptable.

Solder Mask

LPI

Liquid Photo-Imageable is the mostly adopted. Thermosetting Ink is used in the inexpensive paper-based boards.

Minimum Character Width(Legend)

0.15mm

Characters of less than 0.15mm wide will be too narrow to be identifiable.

Minimum Character Height (Legend)

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0.8mm

Characters of less than 0.8mm high will be too small to be recognizable.

Character Width to Height Ratio (Legend)

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1:5

In PCB silkscreen legends processing, 1:5 is the most suitable ratio

Minimum Diameter of Plated Half Holes

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0.4mm

Design Half-Holes greater than 0.4mm to ensure better connection between boards.

Surface Finishing

HASL with lead, HASL lead free, Immersion gold, OSP, Hard Gold, Immersion Silver, Immersion Tin, ENEPIG;

Please view the below "Advanced PCB" or contact us for other finishes.

Solder Mask

Green, Red, Yellow, Blue, White, Black, Matt green, Matte black, Purple, none;

No extra charge (Green, Red, Yellow, Blue)

Silkscreen

White, Black, Yellow, None

No extra charge (White, Black)

Panelization

V-scoring,

Tab-routing,

Tab-routing with Perforation (Stamp Holes)

Leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero.

Others

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Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008,UL Certificate

No extra charge.

No.

Category

PCB Process Parameters

Remarks

1 

Multi-layer Boards

Standard 3–16 Layers /

Medium 18–24 / High > 24

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2 

Blind & Buried Vias (HDI)

1 + 1 + N HDI, Any-Layer HDI

High-density designs require thickness-to-diameter review.

3 

Surface Finishes

HASL, ENIG, OSP, ENEPIG, Hard Gold Fingers, Partial Gold

Partial gold or selective finish available.

4 

Material

FR-4, Aluminum, Rogers 4-Series + FR-4 Hybrid, CEM-3

Pure PTFE boards require special lamination process.

5 

Drill Diameter Range

0.20 – 6.5 mm

Below 0.2 mm = HDI via laser process.

6 

Aspect Ratio (Thickness : Hole)

≤ 8 (Standard), 10 (Medium), 12 (High)

> 12 requires special plating control.

7 

Countersink / Counterbore

Ø 3.0 – 6.5 mm, Depth Tolerance ± 0.15 mm

Non-standard outside range.

8 

Hole Position Tolerance

± 0.075 mm → ± 0.05 mm

< ± 0.05 mm = High Precision.

9 

Hole Diameter Tolerance

PTH ± 0.075 → ± 0.05 mm / NPTH ± 0.05 → ± 0.025 mm

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10   

Hole-to-Hole Spacing

Component ≥ 16 mil / Via ≥ 11 mil

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11 

Slots & Cut-Outs

Plated ≥ 0.5 mm / Non-Plated ≥ 0.8 mm

CNC machined.

12 

Castellated Holes

Diameter ≥ 0.5 mm, Edge ≥ 0.3 mm

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13 

Inner Layer Clearance

4 L ≥ 7 mil, 6 L ≥ 8 mil, 8 L ≥ 9 mil, 10 L ≥ 10 mil

Increase 1 mil for every +2 layers.

14 

Inner Layer Min Width/Spacing

18 µm Cu → ≥ 4/4 mil   

35 µm Cu → ≥ 4/5 mil

< 3.5/3 mil = non-standard.

15 

Outer Layer Min Width/Spacing

18 µm Cu → ≥ 4/5 mil   

35 µm Cu → ≥ 5/6 mil

< 3.5/3.5 mil requires review.

16 

Grid Trace Width/Spacing

18 µm Cu → ≥ 7/9 mil   

35 µm Cu → ≥ 9/11 mil

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17 

Annular Ring (Outer)

18 µm Cu → Via ≥ 5 mil, Component ≥ 8 mil

Increase with copper thickness.

18 

Trace Width Tolerance

± 20 % (Standard), ± 10 % (Medium)

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19 

Line-to-Edge Distance

CNC ≥ 0.25 mm

< 0.20 mm needs review.

20 

Plating Thickness (ENIG)

Ni 100–150 µin / Au 1–8 µin

> 8 µin requires quotation review.

21 

Hole Copper Thickness

Through 18–25 µm / HDI 30–50 µm / High > 50 µm

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22 

Copper Thickness (Layers)

0.5 – 4 oz (Standard), 4 – 6 oz (Medium)

> 6 oz = non-standard.

23 

Solder Mask Opening & Bridge

Opening ≥ 2 mil / Bridge ≥ 4 mil (≥ 4.5 mil for black oil)

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24 

Solder Mask Colors

Green, Matte Green, Blue, Red, Black, Matte Black, White, Yellow

Special colors available upon request.

25 

Etched Copper Legend

18 µm Cu → 8 mil width / 40 mil height

Adjust by copper thickness.

26 

Max Board Thickness

Double Side ≤ 4.5 mm / Multilayer ≤ 4.5 mm

> 4.5 mm requires review.

27 

Min Board Thickness

1/2 Layer ≥ 0.3 mm / 4 L ≥ 0.6 mm / 6 L ≥ 0.9 mm / 8 L ≥ 1.2 mm

Thinner boards require support panel.

28 

Thickness Tolerance (Multi-layer)

T≤1.0 ± 0.10 mm / T≥3.2 ± 8 %

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29 

Max Board Size

508 × 610 mm (Single / Double)   

508 × 600 mm (Multi-layer)

Larger requires review.

30 

Min Board Size

≥ 20 mm

10–20 mm requires fixture handling.

31 

Beveling (Gold Finger)

Angle 20° / 30° / 45° / 60°

Tolerance ± 5°.

32 

Outline Tolerance

± 0.10 – 0.15 mm

< ± 0.10 mm requires special control.

33 

V-Cut Parameters

Angle 30°–45° / Residual Thickness ≥ 0.25 mm

Below 0.5 mm = single-sided V-cut.

34 

Panel Size Range

Min 100 × 120 mm / Max 508 × 610 mm

< 0.4 mm board ≤ 14 inch panel max.

35 

Impedance Control

± 10 % (standard), ± 5 Ω for ≤ 50 Ω lines

Controlled per IPC-2141B.

36 

Bow & Twist

≤ 0.75 % (standard), ≤ 0.5 % (high precision)

IPC Class 2 / 3 compliant.

37 

HASL Process Limits

Hole > 0.5 mm / Tin Thickness 2–30 µm

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38 

Acceptance Standard

IPC-A-600 / IPC Class 2 or 3

Default Class 2 unless specified.