PCBasic PCB Capabilities 

Items

Manufacturing Capabilities

Remarks

Number of Layers 

1–14 layers

For PCBs above 14 layers, please refer to Advanced PCB or contact our sales representative.

Base Material 

FR-4, Aluminum, Copper Base

For Flex, Rigid-Flex, HDI, Halogen-Free, or High-Tg materials, please refer to Advanced PCB.

Maximum PCB Size 

Single/Double-Sided: 600 × 1200 mm    

Multi-layer: 560 × 1150 mm    

(Min: 3 × 3 mm)

Larger sizes available upon request.

Board Size Tolerance 

±0.2 mm (CNC Routing)    

±0.5 mm (V-Scoring)

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Board Thickness

0.2 – 3.2 mm

Common options: 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 / 2.4 / 3.2 mm

Thickness Tolerance (t ≥ 1 mm) 

±10 %

Slight +Tolerance may occur due to plating and surface finish.

Thickness Tolerance (t < 1 mm) 

±0.10 mm

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Minimum Trace Width /

Spacing 

0.10 mm (4 mil) / 

0.10 mm (4 mil)

For finer spacing, see Advanced PCB.

Outer Copper Thickness 

1 – 8 oz (35 – 280 µm)

Standard: 1 oz; Contact us if > 8 oz.

Inner Copper Thickness 

1 – 4 oz (35 – 140 µm)

For multi-layer boards, contact us if > 4 oz.

Drill Size (CNC)

0.15 – 6.0 mm

Holes > 6 mm or < 0.2 mm may require extra cost.

Annular Ring (Min.) 

0.15 mm (6 mil)

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Finished Hole Diameter

0.15 – 6.0 mm

Hole size after plating slightly smaller than drill bit.

Hole Diameter Tolerance 

PTH ± 0.08 mm / NPTH ± 0.05 mm

Example: 0.6 mm drill → 0.52 – 0.68 mm finished.

Solder Mask Type

LPI (Liquid Photo Imageable)

Standard industrial grade.

Solder Mask Colors 

Green, Red, Yellow, Blue, White, Black, Matte Green, Matte Black, Purple, None

No extra charge for green/red/yellow/blue.

Silkscreen Colors

White, Black, Yellow, None

No extra charge for white or black.

Minimum Character Width / Height 

Width ≥ 0.15 mm / Height ≥ 0.8 mm

Ratio 1 : 5 recommended for clarity.

Plated Half Holes (Castellated) 

Min diameter ≥ 0.4 mm

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Surface Finishes 

HASL (Lead / Lead-Free), ENIG (Immersion Gold), OSP, Hard Gold, Immersion Silver, Immersion Tin, ENEPIG

Other finishes available upon request.

Panelization Options 

V-Scoring, Tab-Routing, Tab-Routing + Stamp Holes

Leave ≥ 1.6 mm clearance for tab-routing; 0 gap for V-cut.

Testing & Certification 

Flying Probe Test (Free), AOI Inspection (Free)    

ISO 9001 / UL Certified

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No.

Category

PCB Process Parameters

Remarks

1 

Multi-layer Boards

Standard 3–16 Layers /

Medium 18–24 / High > 24

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2 

Blind & Buried Vias (HDI)

1 + 1 + N HDI, Any-Layer HDI

High-density designs require thickness-to-diameter review.

3 

Surface Finishes

HASL, ENIG, OSP, ENEPIG, Hard Gold Fingers, Partial Gold

Partial gold or selective finish available.

4 

Material

FR-4, Aluminum, Rogers 4-Series + FR-4 Hybrid, CEM-3

Pure PTFE boards require special lamination process.

5 

Drill Diameter Range

0.20 – 6.5 mm

Below 0.2 mm = HDI via laser process.

6 

Aspect Ratio (Thickness : Hole)

≤ 8 (Standard), 10 (Medium), 12 (High)

> 12 requires special plating control.

7 

Countersink / Counterbore

Ø 3.0 – 6.5 mm, Depth Tolerance ± 0.15 mm

Non-standard outside range.

8 

Hole Position Tolerance

± 0.075 mm → ± 0.05 mm

< ± 0.05 mm = High Precision.

9 

Hole Diameter Tolerance

PTH ± 0.075 → ± 0.05 mm / NPTH ± 0.05 → ± 0.025 mm

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10   

Hole-to-Hole Spacing

Component ≥ 16 mil / Via ≥ 11 mil

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11 

Slots & Cut-Outs

Plated ≥ 0.5 mm / Non-Plated ≥ 0.8 mm

CNC machined.

12 

Castellated Holes

Diameter ≥ 0.5 mm, Edge ≥ 0.3 mm

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13 

Inner Layer Clearance

4 L ≥ 7 mil, 6 L ≥ 8 mil, 8 L ≥ 9 mil, 10 L ≥ 10 mil

Increase 1 mil for every +2 layers.

14 

Inner Layer Min Width/Spacing

18 µm Cu → ≥ 4/4 mil   

35 µm Cu → ≥ 4/5 mil

< 3.5/3 mil = non-standard.

15 

Outer Layer Min Width/Spacing

18 µm Cu → ≥ 4/5 mil   

35 µm Cu → ≥ 5/6 mil

< 3.5/3.5 mil requires review.

16 

Grid Trace Width/Spacing

18 µm Cu → ≥ 7/9 mil   

35 µm Cu → ≥ 9/11 mil

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17 

Annular Ring (Outer)

18 µm Cu → Via ≥ 5 mil, Component ≥ 8 mil

Increase with copper thickness.

18 

Trace Width Tolerance

± 20 % (Standard), ± 10 % (Medium)

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19 

Line-to-Edge Distance

CNC ≥ 0.25 mm

< 0.20 mm needs review.

20 

Plating Thickness (ENIG)

Ni 100–150 µin / Au 1–8 µin

> 8 µin requires quotation review.

21 

Hole Copper Thickness

Through 18–25 µm / HDI 30–50 µm / High > 50 µm

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22 

Copper Thickness (Layers)

0.5 – 4 oz (Standard), 4 – 6 oz (Medium)

> 6 oz = non-standard.

23 

Solder Mask Opening & Bridge

Opening ≥ 2 mil / Bridge ≥ 4 mil (≥ 4.5 mil for black oil)

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24 

Solder Mask Colors

Green, Matte Green, Blue, Red, Black, Matte Black, White, Yellow

Special colors available upon request.

25 

Etched Copper Legend

18 µm Cu → 8 mil width / 40 mil height

Adjust by copper thickness.

26 

Max Board Thickness

Double Side ≤ 4.5 mm / Multilayer ≤ 4.5 mm

> 4.5 mm requires review.

27 

Min Board Thickness

1/2 Layer ≥ 0.3 mm / 4 L ≥ 0.6 mm / 6 L ≥ 0.9 mm / 8 L ≥ 1.2 mm

Thinner boards require support panel.

28 

Thickness Tolerance (Multi-layer)

T≤1.0 ± 0.10 mm / T≥3.2 ± 8 %

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29 

Max Board Size

508 × 610 mm (Single / Double)   

508 × 600 mm (Multi-layer)

Larger requires review.

30 

Min Board Size

≥ 20 mm

10–20 mm requires fixture handling.

31 

Beveling (Gold Finger)

Angle 20° / 30° / 45° / 60°

Tolerance ± 5°.

32 

Outline Tolerance

± 0.10 – 0.15 mm

< ± 0.10 mm requires special control.

33 

V-Cut Parameters

Angle 30°–45° / Residual Thickness ≥ 0.25 mm

Below 0.5 mm = single-sided V-cut.

34 

Panel Size Range

Min 100 × 120 mm / Max 508 × 610 mm

< 0.4 mm board ≤ 14 inch panel max.

35 

Impedance Control

± 10 % (standard), ± 5 Ω for ≤ 50 Ω lines

Controlled per IPC-2141B.

36 

Bow & Twist

≤ 0.75 % (standard), ≤ 0.5 % (high precision)

IPC Class 2 / 3 compliant.

37 

HASL Process Limits

Hole > 0.5 mm / Tin Thickness 2–30 µm

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38 

Acceptance Standard

IPC-A-600 / IPC Class 2 or 3

Default Class 2 unless specified.