Surface-mount components are the core part of modern electronic products. Almost all electronic devices, such as smartphones, laptops, automotive electronic equipment and industrial control systems, rely on surface mount components. When choosing components, selecting the appropriate surface-mount packaging size is of crucial importance. Each surface-mount component has multiple standardized packaging sizes. The size of the surface mount packaging directly affects the layout of the printed circuit board, the current-carrying capacity and the product reliability.
International standard organizations, such as JEDEC and IPC, have already established precise specifications for SMD packaging types to ensure consistency in production worldwide. By reducing compatibility issues, reducing costs and accelerating product launch times, these standards help engineers design printed circuit boards that are reliable globally and easy to manufacture.
In this article, we will introduce the most common surface-mount device packaging sizes. Without further ado, let's get straight to the point!
SMD Package Sizes for Passive Components
The most widely used passive components in electronic products are resistors, capacitors, inductors, diodes and LEDs. All of them have standardized package sizes. Next, we will introduce the package sizes of these components.
SMD Resistor Package Sizes
SMD resistors are the most common SMD components in PCB design. The space utilization of the circuit board, current-carrying capacity, resistance value accuracy, and manufacturability are all related to the appropriate SMD resistor package size. Larger packages can dissipate heat better and withstand higher currents, while smaller packages are suitable for high-density board layouts and compact electronic products. For example, the 0603 package size (1.6 × 0.8 mm) resistor is very popular because it strikes a good balance between compactness and good solderability. However, smaller 0201 or 01005 resistors, although they can significantly save PCB space, have higher requirements for the precision of the placement machine and the reflow soldering process.
The following is the most common SMD resistor package size table, including their standard dimensions and typical power ratings:
|
Package Code
|
Dimensions (L × W, mm)
|
Typical Power Rating
|
Applications
|
|
1206
|
3.2 × 1.6
|
1/4 W
|
Power circuits, automotive electronics
|
|
0805
|
2.0 × 1.25
|
1/8 W
|
General-purpose designs, balance of size vs. power
|
|
0603
|
1.6 × 0.8
|
1/10 W
|
Most common size, widely used in consumer and industrial electronics
|
|
0402
|
1.0 × 0.5
|
1/16 W
|
High-density devices such as smartphones and laptops
|
|
0201
|
0.6 × 0.3
|
1/20 W or less
|
Miniaturized products, wearable devices
|
|
01005
|
0.4 × 0.2
|
~1/32 W
|
Ultra-compact designs, advanced mobile and medical electronics
|
SMD Capacitor Package Sizes
SMD capacitor package sizes determine the range of capacitance of the capacitor. The withstand voltage capacity, equivalent series resistance (ESR), reliability, and performance in high-frequency circuits are all affected by package size. In the design process, the selection of capacitor package size depends on the requirements of the circuit for capacitance, withstand voltage level, board density, and mechanical stress.
The following table summarizes the common SMD capacitor package sizes, the corresponding capacitance range, and typical applications:
|
Package Code
|
Dimensions (L × W, mm)
|
Typical Capacitance Range
|
Typical Applications
|
|
1206
|
3.2 × 1.6
|
0.1 µF – 100 µF
|
Power decoupling, automotive electronics, power filtering
|
|
0805
|
2.0 × 1.25
|
0.01 µF – 47 µF
|
General-purpose circuits, communication devices
|
|
0603
|
1.6 × 0.8
|
0.01 µF – 22 µF
|
Consumer electronics, industrial control; balance between size and performance
|
|
0402
|
1.0 × 0.5
|
0.5 pF – 10 µF
|
High-density devices such as smartphones and laptops
|
|
0201
|
0.6 × 0.3
|
0.5 pF – 1 µF
|
Wearable devices, portable medical electronics
|
|
01005
|
0.4 × 0.2
|
0.3 pF – 0.5 µF
|
Ultra-high-density designs, RF circuits, advanced mobile devices
|
It should be noted that as the package size decreases, the capacitance's withstand voltage capacity will decrease, while the mechanical stress sensitivity will increase. Therefore, when selecting the sizes of SMD capacitors, a strict derating design must be carried out to avoid failure.
SMD Inductor Package Sizes
SMD inductors are indispensable passive components in power management, RF circuits and filtering applications. Below is a comparison table of common SMD inductor package sizes:
Note: When the size of the inductor package is reduced, its current-carrying capacity will decrease and the DC resistance will increase.
|
Package Code
|
Dimensions (L × W, mm)
|
Typical Inductance Range
|
Applications
|
|
0402
|
1.0 × 0.5
|
1 nH – 100 nH
|
RF circuits, impedance matching, mobile devices
|
|
0603
|
1.6 × 0.8
|
10 nH – 10 µH
|
General-purpose signal filtering, smartphones, tablets
|
|
0805
|
2.0 × 1.25
|
0.1 µH – 47 µH
|
Consumer electronics, DC-DC converters
|
|
1206
|
3.2 × 1.6
|
0.47 µH – 100 µH
|
Power supply modules, automotive electronics
|
|
1210
|
3.2 × 2.5
|
1 µH – 220 µH
|
Power inductors for industrial and automotive designs
|
|
1812
|
4.5 × 3.2
|
10 µH – 470 µH
|
High-current circuits, LED drivers, power modules
|
SMD Diode Package Sizes
SMD diodes are mainly used for rectification, signal switching, voltage regulation and ESD protection. Below is a comparison table of common SMD diode package sizes:
|
Package Code
|
Dimensions (L × W, mm)
|
Typical Power / Current Handling
|
Applications
|
|
SOD-323
|
1.7 × 1.25
|
Up to ~200 mA
|
Signal diodes, portable electronics
|
|
SOD-523
|
1.2 × 0.8
|
Up to ~100 mA
|
Ultra-compact devices, RF circuits
|
|
SOD-123
|
2.6 × 1.6
|
0.5 – 1 A
|
General switching and rectification
|
|
SMA
|
4.5 × 2.6
|
1 – 2 A
|
Power rectifiers, TVS protection
|
|
SMB
|
5.3 × 3.5
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3 – 5 A
|
Automotive electronics, surge protection
|
|
SMC
|
7.0 × 6.2
|
5 – 10 A
|
High-current rectifiers, industrial power modules
|
SMD LED Package Sizes
SMD LEDs are widely used in indicator lights, displays and general lighting. The standardized LED packaging size enables engineers to easily select the appropriate LED based on brightness, color and heat dissipation requirements.
Here is a reference table for SMD LED sizes, which lists the typical dimensions and their applications:
|
Package Code
|
Dimensions (L × W, mm)
|
Typical Power
|
Applications
|
|
2835
|
2.8 × 3.5
|
0.2 – 0.5 W
|
Compact lighting, indicator LEDs, consumer electronics
|
|
3528
|
3.5 × 2.8
|
0.1 – 0.2 W
|
Status indicators, backlighting for displays
|
|
5050
|
5.0 × 5.0
|
0.2 – 0.5 W (per chip)
|
RGB LEDs, decorative lighting, LED strips
|
|
5630
|
5.6 × 3.0
|
0.5 – 1.0 W
|
High-brightness LED strips, panel lights
|
|
5730
|
5.7 × 3.0
|
0.5 – 1.0 W
|
High-power applications, general illumination
|
Common SMD Tantalum Capacitor Sizes
SMD tantalum capacitors are case code common surface-mounted capacitors. Tantalum capacitors are usually represented by an to indicate different package sizes. The size of its enclosure directly determines its capacitance range and rated voltage. Generally, the polarity (+ pole) and voltage rating will also be marked on the device's enclosure to facilitate assembly and testing.
Here is a comparison table of common SMD tantalum capacitor package sizes:
|
Case Code
|
Dimensions (L × W, mm)
|
Typical Capacitance Range
|
Voltage Rating
|
Applications
|
|
A
|
3.2 × 1.6
|
0.1 µF – 47 µF
|
4 V – 10 V
|
Smartphones, portable electronics
|
|
B
|
3.5 × 2.8
|
1 µF – 100 µF
|
6.3 V – 16 V
|
Consumer electronics, general decoupling
|
|
C
|
6.0 × 3.2
|
10 µF – 220 µF
|
10 V – 25 V
|
Power supply filtering, industrial electronics
|
|
D
|
7.3 × 4.3
|
47 µF – 470 µF
|
16 V – 35 V
|
Automotive electronics, power circuits
|
|
E
|
7.3 × 4.3 (thicker height)
|
100 µF – 680 µF
|
25 V – 50 V
|
High-capacitance, high-voltage decoupling
|
SMD Transistor Packages
SMD transistors are widely used in amplification, switching, voltage regulation and power management circuits. Among them, the SOT series packaging is the most common form. Here is a comparison table of common SMD transistor package sizes:
|
Package Type
|
Dimensions (Approx., mm)
|
Features / Current Handling
|
Typical Applications
|
|
SOT-23
|
2.9 × 1.3
|
One of the most popular, up to ~500 mA
|
General-purpose switching, signal transistors
|
|
SOT-223
|
6.5 × 3.5
|
Larger body, excellent thermal dissipation
|
Voltage regulators, power transistors
|
|
SOT-89
|
4.5 × 2.5
|
Medium size, up to ~1 A, good heat handling
|
Linear regulators, RF power devices
|
|
SC-70 / SC-90
|
~2.0 × 1.25
|
Ultra-small, limited current (~100–200 mA)
|
Portable electronics, mobile devices
|
|
DFN (Dual Flat No-Lead)
|
Varies (e.g., 2 × 2, 3 × 3)
|
Compact, excellent electrical/thermal properties
|
High-frequency, low-profile designs
|
|
QFN (Quad Flat No-Lead)
|
Varies (e.g., 4 × 4, 5 × 5)
|
Very good thermal path, high pin count
|
Power management ICs, RF and high-speed devices
|
SMD IC Packages
Modern electronic devices are built on SMD IC packages. They are essential to nearly all complicated circuits, including industrial control systems, consumer electronics, and automobile electronics. Different SMD IC package sizes are appropriate for various design needs; some prioritize high pin density and small size, while others prioritize dependable electrical connections and heat dissipation performance.
The common packaging types mainly include:
|
Package Type
|
Dimensions (Approx., mm)
|
Pin Count / Features
|
Typical Applications
|
|
SOIC (Small Outline IC)
|
3.9 × 4.9 (8-pin) to larger sizes
|
8–28 pins, gull-wing leads
|
Standard ICs, logic devices, EEPROMs
|
|
SSOP (Shrink Small Outline Package)
|
Smaller than SOIC
|
Higher pin density, thinner pitch
|
Consumer electronics, memory ICs
|
|
TSSOP (Thin Shrink Small Outline Package)
|
~6.4 × 4.4 (20-pin) and variants
|
Even thinner, high pin counts
|
High-density logic ICs, analog/digital converters
|
|
QFP (Quad Flat Package)
|
7 × 7 to >20 × 20
|
Up to several hundred pins, gull-wing
|
Microcontrollers, DSPs, ASICs
|
|
QFN (Quad Flat No-Lead)
|
3 × 3 to 12 × 12 (typical)
|
Compact, excellent thermal path
|
Power ICs, RF devices, compact controllers
|
|
BGA (Ball Grid Array)
|
Varies (e.g., 10 × 10, 17 × 17)
|
High pin count, solder balls underneath
|
CPUs, GPUs, high-performance processors
|
|
CSP (Chip Scale Package)
|
Near chip size, ~2 × 2 and above
|
Extremely small footprint, minimal packaging overhead
|
Smartphones, portable electronics, memory ICs
|
How to Choose the Right SMD Package Size？
Choosing the appropriate SMD package size is a crucial step. When selecting the size, several key factors should be considered:
Board-level density and layout - To achieve a more compact design, smaller surface-mount components such as 0402 or 0201 should be chosen.
Power dissipation and current carrying capacity - If the components need to handle higher currents and dissipate heat more effectively, larger SMD package sizes (such as 1206 resistors, SMC diodes) should be selected.
Reliability and mechanical stress - For applications such as automotive or industrial use where mechanical reliability is highly demanded, engineers often choose slightly larger SMD package sizes.
When making a choice, a practical method is to refer to the SMD size comparison table, comparing the physical dimensions, power ratings and typical applications of different SMD package sizes. This can help us find the best balance among performance, cost, manufacturability and long-term reliability.
Conclusion
Selecting the appropriate SMD package size is essential for striking a balance between cost, manufacturability, performance, and reliability. Engineers may develop reliable, efficient, and small electronic products by using an SMD size chart and knowing SMD component sizes for resistors, capacitors, and ICs.
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