Leadless hard gold plating is an improved electroplating process. Different from the traditional method, it does not require additional leads to conduct electricity during the gold plating process. The entire copper layer itself can conduct electricity, thus simplifying and stabilizing the electroplating process.
This technology is often used to manufacture high-density, high-precision and compact small electronic products, such as smart devices, communication modules and high-end control circuits, etc. Because this plating method can ensure that the circuit surface is smoother and the coating is more uniform, it has very prominent advantages in the electronics industry, which has extremely high requirements for reliability and fine-pitch design.
Key Features of Leadless Hard Gold Plating
1. Leadless Design
In traditional gold electroplating, extra leads need to be connected to the plating area to conduct electricity and ensure that the current can flow smoothly. However, lead-free hard gold plating does not require these leads. The entire copper layer of the PCB can conduct electricity, allowing the current to be evenly distributed during the plating process. After electroplating is completed, the excess parts are removed through etching, which not only makes the process simpler but also reduces impurities and pollution.
2. Gold Plating Before Etching
This process is different from the traditional one. It involves first plating a layer of gold on the entire copper surface and then etching the circuit. In this way, the gold layer will evenly cover all the copper surfaces. Then, the unnecessary areas will be etched away, leaving only the circuits and pads. This method can make the electroplating process more efficient and is particularly suitable for electronic components such as QFN and BGA that are leadless and fine-pitch.
3. Controlling Galvanic Corrosion
At the beginning, the gold layer covers the entire copper surface. During the etching process, sometimes the copper at the bottom of the pad will be exposed, and a potential difference will be generated between the gold and copper, thereby triggering electrochemical corrosion (that is, the galvanic effect). To avoid this situation, it is necessary to strictly control the process parameters during production and take protective measures in the design stage to ensure that the solder pads are not corroded.
Advantages in Modern Electronics
Leadless hard gold plating offers higher surface flatness, excellent wear resistance and superior solderability - all of which are essential for compact, high-frequency or multi-layer circuit boards. As electronic products continue to evolve towards miniaturization and high density, this electroplating method offers a cleaner and more efficient solution for achieving reliable performance.
