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There is a need to understand what BGA is before venturing into what BGA Assembly is all about. BGA, also called ball grid array, is a form of IC package whose pins are placed in solder ball form. In contrast to conventional technologies for packaging, BGA works with higher-density pin layouts.
Due to technological advancements, PCB design for small and complex chips has experienced a huge rise in demand. Hence, working with a packaging method that accommodates these high I/O density chips while ensuring cost-effectiveness is important. This is where BGA plays an important role.
In this article, you will understand what BGA Assembly is, its pros and cons, and the challenges faced during assembly. We will also explain how to check the quality of solder joints. Please read on as we explain the topic further.
Manufacturers use BGA Assembly to mount devices with hundreds of pins. BGA Assembly differs from SMD packaging. This is because BGA Assembly is an automated process. Also, it requires accurate control during the soldering process. With BGAs, it is possible to reduce the resistance by applying thermally-enhanced mechanisms.
Furthermore, BGA Assembly features higher functional capabilities. This feature benefits high-speed and high-power ICs requiring advanced thermal and electrical performance.
Now, let’s consider the benefits of BGA Assembly compared to conventional packages.
Due to the physical structures of the BGA components, visual inspection won’t work. Therefore, an X-ray inspection helps to check soldering defects. These defects include short circuits, voids, air holes, and more.Electrical tests help to find defects like short and open circuits.
The soldering process isn’t easy, and even the use of machines isn’t accurate. Therefore, it is possible to face soldering defects during BGA Assembly. These defects include excessive soldering, openings, solder bridges, component shifting, etc.
Repair and Rework
Repair and rework tasks on BGA Assemblies are usually challenging. This is because of its dense components. Also, there is a need for specialized skills and tools.
The BGA assembly is always very close to the solder balls. This makes it very challenging to perform an inspection on the package.
The process of BGA Assembly could be time-consuming. This is because the engineer must properly attach the components to the board before soldering.
Visual Inspection (Optical Inspection)
This method for checking solder joint quality is only effective for detecting defects. These include closed circuits, the absence of solder in joints, and more. The method is straightforward because you only need the naked eye to inspect.
This method detects bridging, incomplete wiring, voiding, and other defects. Also, it can detect majority of defects on leads and pads.
This method involves inspecting the solder joints using an X-ray device. The X-ray machine is composed of the X-ray source and detector. Both are connected to the system and used to transfer the image to a screen. X-ray inspection is fast and automated, thereby saving time.
There are many sub-categories of PCB assembly, such as layered layers:
single-sided, double-sided, and multi-layer circuit boards; material properties:
FPC, PCB, FPCB; Pcb. Thus, when you choose a pcb assembly manufacturer for your project, you need to have a deep understanding of the characteristics of the project
know which points need special attention to pick the most suitable pcb assembly manufacturer.
BGA assembly professional factory, PCBasic provides you with Turnkey BGA
What are the characteristics of BGA? On the back of the BGA printed substrate, spherical bumps are made in an array
manner to replace pins. The spherical bumps are solder balls, which serve as the
connection interface between the packaged IC and the PCB. BGA is a
high-performance, small size, lightweight IC package. Compared with other
packaging technologies, BGA can accommodate more pins.
What are the advantages of BGA? Compared with the previous packaging technology, the thickness and weight are
reduced; the parasitic parameters are reduced, the signal transmission delay is
small, and the frequency of use is improved; the assembly can be coplanar
welding, with high reliability, excellent heat dissipation capacity, electrical
characteristics, and high-efficiency system. Product compatibility.
Professional engineers will review the order, conduct process evaluation and
Store BGA at low temperature, bake before going online and standardize operations
Complete process capability, sophisticated BGA placement machine
Professional PCBA inspection services, such as SPI, AOI, X-Ray, etc.
Fixture production and functional testing
Fastest delivery time of 3-5 days
Has passed ISO: 9001 quality certification to ensure that our products meet
At PCBasic, our rich BGA assembly experience and professional SMT assembly line,
as well as standardized assembly services, can place BGA components with a pitch
of 0.2MM for you.
PCBasic focuses on providing Turnkey BGA Assembly services for small and medium-sized
enterprises. What large companies are unwilling to do and what small companies
cannot do well is what PCBasic focuses on.
For more detailed BGA knowledge and other PCB related knowledge, please click here
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PCBasic firmly believes that quality is the soul of products, and strictly abides by every standard, every process of production, and every detail of service!