Solder Mask Bridge

Some precautions:

1. When using green solder mask ink for solder bridge design on PCBs with a copper thickness of 1oz, 2oz, or 3oz, the spacing between IC pads should be no less than 0.20mm.

2. If the spacing between IC pads is less than 0.22mm, then on 1oz/2oz/3oz copper plates using blue, red, white, yellow, black, or matte black solder mask ink, solder mask bridge connections cannot be achieved.

3. For circuit boards with copper thicknesses ranging from 3oz to 10oz, if solder bridges are required in the design, the width and spacing of IC pads should be greater than or equal to the minimum line width and line spacing requirements for the corresponding copper thickness.

For example, on a 3oz copper-thick circuit board, the line width/line spacing should be ≥ 0.25mm/0.23mm. Therefore, the spacing between IC pads must be at least 0.23mm to meet the conditions for solder bridge fabrication.

When placing orders with PCBasic, we recommend:

Adjust the spacing of the IC pads to meet the solder mask bridge design standards of PCBasic, in order to ensure process feasibility and welding reliability. Of course, if you wish to maintain the current design, PCBasic can also produce according to the original file, but no solder mask bridges will be retained between the IC pads to avoid processing risks.