1. What should be done if the actual size of the surface mount component (SMD) is larger than the pad pattern in the design?
You can redesign the pad size according to the recommended pad design in the device data sheet. If the design cannot be modified temporarily, an alternative model (MPN) compatible with the package can also be provided.
Note: For large-sized devices, sufficient spacing should be maintained from adjacent pads during design to prevent interference or bridging during soldering.
2. If the through-hole component conflicts with the position of the nearby surface mount component, how should it be handled?
It is recommended to solder the SMD components first in the assembly sequence, and then insert and solder the through-hole components. If the interference problem still exists, the hole positions can be adjusted or smaller packaged devices can be replaced in the subsequent revision.
3. What should be done if the silk-screen printing or polarity marking of the device does not match the actual soldering direction?
Incorrect silk-screen direction may cause the components to be mounted in the opposite direction or with incorrect polarity, thereby resulting in functional failure. Please carefully check whether the silk-screen printing, polarity points and component packaging directions are consistent before submitting the documents, especially for diodes, electrolytic capacitors and IC chips (such as QFN, SOP, BGA, etc.).
If any errors are found, please update the Gerber file in a timely manner and reconfirm, and contact your sales representative.
