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Inside this container, a pump device creates a rising wave of solder that resembles a stationary wave. As the circuit board interfaces with this solder wave, it facilitates the soldering of its components to the board.
1. Spray Flux Application: This method involves spraying a fine mist of flux onto the underside of the board that is going for soldering. In some systems, a compressed air jet may remove excess flux, ensuring precise application.
Setting the preheating temperature varies based on the type of assembly or PCB:
Before starting, it's crucial to thoroughly check the wave soldering machine, which involves examining the condition of the furnace surface, ensuring the tin slag is in good shape, and verifying the pressure air supply.
Regular maintenance is essential to avoid potential hazards, such as loose screws, slow chain speed, and rusted drive shafts. These issues can lead to board detachment and poor quality after soldering.
The heat generated during soldering can weaken the adhesion of copper, making the board fragile. It's crucial to handle the board carefully when removing it from the soldering machine to prevent components from lifting.
Solder shorts occur when the solder fails to separate from two or more leads before solidifying. To prevent this issue, reducing the length and size of the pad can help minimize the amount of solder that adheres to the board. These measures contribute to a safer and higher-quality wave soldering process.
It's crucial to maintain a steady solder flow to prevent insufficient hole fill, which may result from slow solder drainage. Slow drainage can lead to excessive solder on the lead, causing it to drain unevenly and create solder trails on the board. Timely removal of the board from the solder wave can also help avoid this issue.
Excessive solder can lead to problems like solder bridging, where solder unintentionally connects two or more leads. Preventing this requires applying a protective coating that hinders solder from bridging connections.
Solder balling, which involves the formation of small solder balls on the board, can be reduced by using the appropriate amount of flux and ensuring the board's cleanliness before soldering.
False soldering and the occurrence of air bubbles can be a result of a wet hole. It's crucial to confirm that the hole is dry before proceeding.
Regularly checking Tin composition is essential to prevent issues such as poor-quality outcomes after the furnace and potential horizontal deformation of the tracks.
Let's take a look at the advantages and disadvantages of each technique:
Reflow Soldering Pros:
Reflow Soldering Cons:
Wave Soldering Pros:
Wave Soldering Cons:
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