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While downtime for Class 2 electronics would lead to economic inefficiencies or work stoppages, safety is not compromised.
Components selected for Class 3 products undergo the following extensive screening:
IPC Class 2 allows for 90% annular ring breakout, provided the minimum literal spacing is maintained. This means connections can utilize almost the entire area within the annular ring, enabling very dense packaging.
When designing a PCB, it is important to specify the appropriate IPC class based on the application's requirements. As we have already seen, IPC classes 2 and 3 are commonly used for general-purpose rigid PCBs. Despite the similarities, there are some key differences in their manufacturing specifications.
The dielectric material between the conductive layers of a printed circuit board (PCB) plays a crucial role in its overall performance. It affects electrical characteristics like signal integrity, as well as physical properties such as heat dissipation and resistance to thermal stresses.
PCB assembly is the process of attaching electronic components to a printed circuit board (PCB) using soldering techniques. Depending on the intended use and reliability of the PCB, different standards and specifications may apply. These are some differences between Class 2 and Class 3 PCBs regarding PCB assembly.
The IPC categorizes surface mount components into fine pitch (lead spacing ≤ 0.8mm but > 0.5mm), very fine pitch (≤ 0.5mm but > 0.3mm), and ultra-fine pitch (≤ 0.3mm). These requirements vary by class.
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