The dual inline package is an IC package in electronics consisting of PCB. Dual inline package is commonly abbreviated as DIL or DIP. DIP chip manufacturing comprises epoxy resin by melting and molding it and then leaving it to rest in a frame with connecting pins incorporated. These pins extend out vertically from the frame. The parallel pins consist of gold, tin, or silver plating.
The essential elements in the structure of a DIP include a lead frame, silicon die, polymer mold, package substrate, and wire bonds of gold.
● They are easily replaceable and, during replacement, do not damage the components in their surroundings.
The dual inline package was invented by three people, namely, Rex Rice, Don Forbes, and Bryant Rogers, in 1964. They considered this invention because of the limitation observed in using ICs due to limited leads on the circuit.
The circuits were becoming increasingly complex, so they needed sufficient signals to work with the complex electronic devices. By developing the DIP package, high-density chip carriers came into being and are even easily fixed on the PCBs.
The DIP package has different types, as shared below:
The dual inline package is used widely in integrated circuits (ICs), and along with that, they are also helpful in resistor networks, LED segmented displays, electromechanical relays, and DIP switches. In most electronic equipment, the DIP connector plugs are also used for ribbon cables.
As you have read the guide above, you must know the dual inline package meaning, its pros and cons, applications, history, and types. Choosing the right DIP package supplier like PCBasic may help you develop and manufacture better electronic products that last longer and perform efficiently.
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