Knowledge Base

Dual Inline Package Meaning (DIP) - PCBasic


A dual inline package is a common component package in electronics comprising a PCB. Understanding the dual inline packaging meaning and associated details is very important to have an idea of its functioning and significance. You are at the right place if you look forward to knowing about the DIP package. The guide below covers the DIP chip's purpose, meaning, history, and more. So, let's read below.

Dual Inline Package Meaning (What is DIP)

what is DIP

The dual inline package is an IC package in electronics consisting of PCB. Dual inline package is commonly abbreviated as DIL or DIP. DIP chip manufacturing comprises epoxy resin by melting and molding it and then leaving it to rest in a frame with connecting pins incorporated. These pins extend out vertically from the frame. The parallel pins consist of gold, tin, or silver plating.

These dual inline packages are mounted on the PCB or inserted by the through-hole technique; they can also be fixed within a socket.

The DIP chip may contain a different number of pins. A DIP chip is represented by the number of pins present within it. For instance, a dual inline package containing eight pins each on two of its rows will have a total of 16 pins, and it would be referred to as DIP16; the one with eight pins on the whole will be called DIP8, and so on.

The number of pins also determines the size of the DIP package. The common number of DIP package pins is 4, 6, 8, 10, 12, 14, 16, etc. Moreover, these pins have different pitches depending on the types of boards they are inserted into, and these may vary between 0.5mm, 0.65mm, 2.54mm, etc.

Structure of Dual Inline Package

dual inline package

The essential elements in the structure of a DIP include a lead frame, silicon die, polymer mold, package substrate, and wire bonds of gold.

The lead frame of the DIP is the main component that ensures the electrical connections are intact and hold the silicon die. An insulation material, a thick package substrate, helps to support the lead frame electrically.

The major component of the DIP package is the silicon die because it has the electronic circuitry that carries out the required functions and processes. On the other hand, wire bonds of gold connect the silicon die and the lead frame to let the electoral signals flow between the external world and the silicon die.

The lead frame also has an added coating of polymer overmold, which protects the components within it. It helps to improve the reliability of the dual inline package. It also keeps the moisture away from getting into the frame.

Pros of DIP

● The DIP package is affordable and simple in structure with no complex layouts leading to additional cost.
● They are highly suitable for a huge production volume because of their easy manufacturing process.
● They suit well with the through-hole mounting methods.
● DIP packages also offer efficient heat dissipation and help avoid overheating issues.

● They are easily replaceable and, during replacement, do not damage the components in their surroundings.

Cons of DIP

● Compared to other packaging types, DIP needs more space on the circuit board.
● Applications equipped with high density may not find DIP suitable because of the limited pin spacing.
● The strength of DIPs is lacking when compared to other types of packaging, and if subjected to bending and twisting, they can get damaged.
● Temperature changes may impact the DIPS, leading to solder joint failure because pins may expand or contract.

History of Dual Inline Package 

history of DIP package

The dual inline package was invented by three people, namely, Rex Rice, Don Forbes, and Bryant Rogers, in 1964. They considered this invention because of the limitation observed in using ICs due to limited leads on the circuit. 

The circuits were becoming increasingly complex, so they needed sufficient signals to work with the complex electronic devices. By developing the DIP package, high-density chip carriers came into being and are even easily fixed on the PCBs.

Variants of DIP Package (Types) 

The DIP package has different types, as shared below:

● Skinny DIP: It is also known as SDIP and comprises a pin center distance of 2.54mm and a width of 7.62mm.
● Plastic DIP: The plastic dual inline package, also known as PDIP, has two rows of pins in parallel, offering protection and insulation for the integrated circuits.
● Ceramic DIP: CDIP offers efficient performance and resistance against moisture, shock, and heat conditions.
● Shrink Plastic DIP: The SDIP comprises a 0.07-inch small lead pitch (1.778 mm).

Dual Inline Package Application 

DIP package on PCB board

The dual inline package is used widely in integrated circuits (ICs), and along with that, they are also helpful in resistor networks, LED segmented displays, electromechanical relays, and DIP switches. In most electronic equipment, the DIP connector plugs are also used for ribbon cables.


As you have read the guide above, you must know the dual inline package meaning, its pros and cons, applications, history, and types. Choosing the right DIP package supplier like PCBasic may help you develop and manufacture better electronic products that last longer and perform efficiently. 

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