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Surface-Mount Technology Issues

 Surface-Mount Technology Issues

Surface-mount technology allows electrical components to be mounted directly on a printed circuit board. Initially known as planar mounting, this technology allows for component-level design. However, some drawbacks to this technology exist. Let's take a look at some of the issues with surface-mount technology.

 Issues with surface-mount technology

 Surface-mount technology has improved the process of PCB assembly considerably, especially in terms of cost and speed. The technology also has several advantages over Through-hole technology, including reduced electromagnetic interference and high-level reliability. It also allows for greater levels of functionality and complexity. Nevertheless, there are some issues that must be addressed when using this new technology.


Surface-mount technology requires multilayer boards to accommodate the SMT components. It should also have a ground plane to prevent interference coupling. This technology allows for smaller component sizes and a more compact overall board. Another benefit of surface-mount technology is the fact that it can be used in double-sided boards. However, this does not mean that there are no issues with this type of board construction.


Although it has many advantages, surface-mount technology also has some drawbacks. For example, the smaller size of the components allows for smaller electronics. Additionally, surface-mount technology allows for automated assembly and soldering. This technology also tends to reduce costs. This is one reason why it is increasingly popular in commercial electronics.


The downside of surface-mount technology is that it is not a zero-defect process. Because of this, custom circuit board assembly services should focus on minimizing the number of defects. In addition, surface-mount technology can result in thermal stress. Nevertheless, it is still one of the most efficient methods available to manufacture electronic boards.


There are many advantages of surface-mount technology over leaded options, including wider availability of components. Surface-mount packages are also more durable than leaded packages. Among the popular surface-mount components are transistors, diodes, and operational amplifiers. Unlike leaded packages, surface-mount components usually have three leads.


Process of mounting components to a printed circuit board


Surface-mount technology is a popular way to mount components on a printed circuit board. It is a more efficient mounting technique than through hole via mounting and is used in over 90 percent of PCBs today. Unlike through-hole technology, however, surface-mount technology issues has special electrical, thermal, and mechanical considerations.


To begin with, a PCB panel must be cut into a size of approximately 18" by 24" and must follow predetermined lines. There are also different software tools available that help designers design and produce SMT-compatible PCBs. Once the design is complete, the PCB is sent to a manufacturing company where the assembly begins. Once the manufacturing company receives the printed circuit board, it will add solder paste to the pads and then pick up the components.


Surface-mount technology differs from through-hole mounting in that the components are attached to the board using solder paste. This paste acts as a temporary adhesive and prevents the components from moving. Surface-mount technology is commonly used in PCB assembly, as it allows for more intricate designs and smaller products.


The process of surface-mounting components is more accurate and reliable than traditional soldering. The process of SMT also results in smaller PCBs that fit components with smaller pins and leads. This technology is becoming indispensable for electronics manufacturers, as it improves the performance of printed circuit boards while reducing processing costs.


Surface-mount devices are small pieces of electronic components that are mounted on the surface of a printed circuit board. These devices may be passive, active, or electromechanical. They usually do not require any solder or other materials. Surface-mount equipment is essential to the assembly process, as it helps to place electronic components onto a circuit board.


The process of surface-mounting involves heating the components' solder pads. When heated, the solder paste bonds with the components on the board. Afterward, these components are integrated by hand or through automated soldering processes that do not mutilate the components. The board is then washed to remove excess solder paste. Too much solder can lead to short-circuiting and component short-circuiting, so it is important to avoid excessive soldering during assembly.


Surface-mount technology is often used in electronic devices, such as mobile phones. These devices feature smaller packages, and pins must be smaller than those on traditional circuit boards. Typically, the components are supplied in tubes, reels, or strips of tape. These devices can also be supplied with a manufacturer's name or logo.


Benefits of surface-mount technology


The use of surface-mount technology has helped to simplify the creation and production of electronic circuitry. The technology is especially useful for circuits that have many components. Another advantage is that it is a highly automated process, which saves time and money for the electronics industry. Furthermore, surface-mount technology allows manufacturers to make circuits with smaller volumes and geometric sizes than through-hole interpolation.


Another advantage of surface-mount technology is that it allows manufacturers to use smaller printed circuit boards. This means that more components can be packed into a smaller space, while still providing the same functionality of a larger board. This allows electronic devices to be much smaller, which in turn allows them to fit into a person's pocket.


The use of surface-mount technology is a good way to reduce costs and improve the quality of electronic devices. Because the components are directly mounted onto the PCB surface, the process is much more automated. The process of applying electronic components to a PCB is known as reflow soldering. This means that there is no need to drill holes in the board.



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