Global high-mix volume high-speed Shenzhen PCBA manufacturer

Polyimide
base material:

Polyimide Flex PET (Transparent)

*Soldering of FPCs of this material is not recommended as it is not resistant to high temperature.

FPC Thickness:

0.08 0.1 0.13 0.14 0.16 0.18 0.2 0.23 0.25 0.26 0.29 0.3± ≥0.35 ≥0.4
* Unit: mm

*The FPC thickness does not include the thickness of stiffener and 3M tape.

Min Track/Spacing:

≥ 0.06mm

Min hole size/
Pad size(diameter):

≥ φ0.15/0.35mm No Drill

Solder Mask
(Coverlay):

Yellow Coverlay White Coverlay Black Coverlay None Transparent

Silkscreen:

White Black None

Edge connector:

Yes No

Stiffener:

without TOP BOT Both sides

Please make sure to note the area which need to stiffen in your file. e.g.
*Unusual parameters will result in a small price increase and longer lead time.

Normally, edge connector need be applied with PI stiffener.

Surface Finish:

Immersion gold (ENIG) OSP Immersion silver(Ag) Immersion Tin

Thickness of
Immersion Gold:

1U" 2U" 3U"

Finished Copper:

0.5 oz Cu(18µm) 1 oz Cu(35µm) 1.5 oz Cu(55µm) 2 oz Cu(70µm)

Inner Copper:

1/3 oz Cu(12µm) 0.5 oz Cu(18µm) 1 oz Cu(35µm)

E-test:

100% No

3M/Tesa tape:

*Unusual parameters will result in a small price increase and longer lead time.

EMI shielding film:

Additional Options:

Other Special
request:

+ Add PO No.