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A printed circuit board (PCB) pad is a flat, metal-plated area on the board used to mount and connect electronic components. Pads serve as the interface between the component leads and the copper traces on them. When a part like a resistor or integrated circuit is soldered to the board, its leads are physically and electrically joined to the pads.
When designing a printed circuit board (PCB), one of the key techniques you'll need to understand is how to place a via on a pad effectively. This process is crucial for creating multilayer boards, where electrical connections must pass through different layers.
Thoughtful pad design is imperative to ensure reliable component mounting and interconnections on a printed circuit board.
Inadequate pad design can undermine reliability and performance in a number of ways. Some key issues caused by improper pad geometries include:
More pad size is needed to provide more solderable areas, risking poor wetting, voids, or weak crystalline joints. These joints are more prone to cracking under thermal or vibration stresses. Excessive spacing between pads allows solder bridging and electrical shorts between adjacent pins.
Non-ideal thermal relief cuts concentrate strain at the joint perimeter instead of mitigating it.
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